Thedesign,thereasoningbehindit,andthecriteriaitwillbejudgedagainst.
Thermal, power and protection components are specified by function and measured performance rather than by manufacturer. Compute silicon and the server platform are named, because platform behaviour under sustained thermal load is the central subject of the proof of concept.
Document set
Request the technical documentation.
These documents are issued on request. Tell us who you are and what you are evaluating, and we will send the relevant set.
Technical White Paper
Revision 1.0 · July 2026 · 19 pages
The full design case: the facilities bottleneck, the ambient problem, system architecture, compute platform, thermal cycle, power architecture with single line diagram, fire protection, monitoring, operating envelope and failure modes, and the proof-of-concept acceptance criteria.
Audience · Silicon and platform partners, infrastructure clients, technical evaluators
RequestTechnical Overview
Illustrated deck · drawings and renders
Drawing set and visual reference — rack elevations, the coupled distribution module, single line diagram EXN-EL-001, thermal circuit schematics and installed-site renders.
Audience · Engineering and installation teams
RequestProduct Brochure
Exeton Corp · commercial summary
The commercial summary: what the node is, what it carries, the configuration range from four to sixteen accelerators, and the path from a single proof-of-concept unit to a fifty-unit rollout.
Audience · Commercial and procurement stakeholders
RequestThe white paper and technical overview are marked commercial in confidence and are released under NDA where required. For a technical walkthrough rather than a document set, request a briefing — the engineering team will take you through the thermal and power design directly.
Appendix A
Specification summary.
The complete envelope in one table — enclosure, environment, thermal, power, protection and monitoring.
Enclosure
01- Rating
- IP55, sealed — zero air exchange with ambient
- Primary rack
- 20U outdoor cabinet + coupled 3U distribution rack
- Shell
- PIR sandwich panel over mineral insulation, UV-stable C4+ coating
- Mounting
- Prepared slab or 600 mm plinth, top-mounted condenser
Environment
02- Design ambient
- 50 °C continuous, excursions to 55 °C, direct sun
- Internal band
- 18–25 °C at equipment intake under varying utilisation
- Ingress
- Dust, sand, salt aerosol and humidity excluded by construction
Thermal
03- Type
- Precision DX, closed loop, inverter-driven compressor + EC fans
- Capacity
- 7.5 kW net sensible at 50 °C ambient (baseline 8× config)
- Condenser
- High-ambient, rated +55 °C, vertical upward discharge
- Fail-safe
- Alarm → staged GPU capping → graceful shutdown → door release
Power
04- Sources
- Solar PV (priority) + grid, via automatic transfer switch
- Inverter
- 15 kW
- UPS
- 10 kW rack-mount online, double conversion, ~3:45 min at load
- Distribution
- 400 V 3φ+N 50 Hz, TN-S, 63 A main, five outgoing ways
- Aggregate design load
- ~11 kW (node ~7.3 kW peak + cooling ~2.5–3.5 kW)
Protection
05- Detection
- Optical smoke + heat on the internal return-air path
- Suppression
- Self-contained rack-mount clean-agent unit
- Interlocks
- Fan/compressor stop, damper close, node power off, door secure
Monitoring
06- Local
- 7-inch door-mounted HMI acting as local DCIM head-end
- Northbound
- Modbus TCP, SNMP v3, MQTT to central DCIM or NOC
- Functions
- Trending, event logging, remote alerting, setpoint control
Appendix C · Component specification policy
Thermal, power and protection components are specified by function and measured performance rather than by manufacturer. Compute silicon and the server platform are named, because platform behaviour under sustained thermal load is the central subject of the proof of concept.
Direct
Exeton Corp · Dubai, United Arab Emirates
Technical enquiries are answered by the engineering team, not a sales desk.